According to a recent report by Taiwan’s Economic Daily News, Taiwan Semiconductor Manufacturing Company (TSMC) is in the process of rolling-out a new 6nm FinFET fabrication process that would give a monthly output of 50,000 wafers. With A8 expected to launch along with iPhone 6 on September 9, TSMC wants to ensure it doesn’t lose majority orders of A9 Chip to other chipmakers. The current chip size is 12-inch, though there is no mention in the report for the wafer size for A9 processor.
TSMC is looking forward to enter the mass production of 16nm A9 processor during the first quarter of 2015, according to the report. Besides part production of A8 processors, TSMC also partners with Apple for iPhone 5s’s Touch ID sensors.
Other chip manufacturing companies like Intel and Global Foundries are also chasing Apple for the orders of A9 chips.
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