Images of internal components of 4.7-inch iPhone 6 are getting leaked as we approach the launch of the next-gen iPhone. French website Nowhereelse.fr has leaked the photos of the logic board of 4.7-inch iPhone 6. According to the source who shared the images with Nowhereelse.fr, the logic board will include support for both near field communication (NFC) and a faster 802.11ac Wi-Fi.
Support for NFC in the iPhone has been in news for quite some time, though there is yet no confirmation from Apple on the same. Also, it is not possible to infer about the NFC support from these images, though 802.11ac would be a part of regular upgrade for the iPhone 6 chip.
NFC support in Apple has been in news for some time, especially for mobile payment–related functions. For short range functions like iBeacon and AirDrop, Apple has until now relied on a combination of Bluetooth and Wi-Fi.
The images only show a bare printed board and there are no chips or other components installed on it. It is tough to give a detailed information about the board, though component locations can be inferred from previous model’s logic board.
(Via Macrumors and AppleInsider)