Apple Issues Packaging and Production Orders for A8 Processor
According to a report by DigiTimes, Apple has issued packaging orders for the next generation A8 mobile processor to three individual Taiwan based companies. If this is true, and comparing it with Apple’s previous patterns, we could be seeing a new line of the iPhone, iPod touch, and iPad, as soon as this fall.
Amkor Technology and STATS ChipPAC have reportedly received 40% of the total packaging orders each, with the remainder of 20% being awarded to Advanced Semiconductor Engineering (ASE), “according to sources”, as the report put it. They also claim that the processor will be somewhat similar to Apple’s current flagship, the A7:
Apple’s A8 chip will be a package-on-package (PoP) SoC solution comprising processors and mobile DRAM in a single package, said the sources.
Apparently, having the processors as well as the DRAM ‘in a single package’ will result in not only better performance, but will also account for better and lower battery consumption.
As for the production, it seems Apple has picked Taiwan Semiconductor Manufacturing Company (TSMC) for them, and they have also “secured wafer bumping orders for the processor as part of its turnkey solution”, as noted by DigiTimes.
While Apple has chosen TSMC for the manufacturing of the processors, speculations suggest that the rival Samsung, will also be producing a portion of the processors, despite them ‘wanting’ to move away from them.